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发明名称
SOLDERING MATERIAL FOR DIE BONDING
摘要
본 발명에 따른 다이 본딩용 솔더재료는 실제적인 조성비가 금 보다 주석의 함량이 높은 공융점을 갖는 주석과 금을 포함하는 공융 혼합물이다.
申请公布号
KR100361591(B1)
申请公布日期
2002.11.21
申请号
KR19997011157
申请日期
1999.11.29
申请人
야마타케 코포레이션
发明人
마수다타카시
分类号
H01L23/488
主分类号
H01L23/488
代理机构
代理人
主权项
地址
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