| 摘要 |
PURPOSE: A method and system for processing substrate are provided to secure interface uniformity in the film thickness of an application film, even if the application processing of a wafer is performed by using the application liquid of high viscosity by the point which is the so-called 'one- stroke' writing. CONSTITUTION: A method and system for processing substrate comprises coating a coating solution on a surface of the substrate(w) while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution onto the substrate from the coating solution discharge nozzle, exposing the substrate to a solvent atmosphere of the coating solution after the step of coating, and reducing pressure inside a container in which the substrate is housed after the step of exposing.
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