发明名称 |
APPARATUS FOR ATTACHING SANDPAPER |
摘要 |
PURPOSE: An apparatus for attaching sandpaper is provided to prevent particles from being accumulated on the sandpaper and to prevent air bubbles between the sandpaper and a dummy wafer, by semiautomatically attaching the sandpaper to the dummy wafer. CONSTITUTION: A stage(110) has a loading surface(114) on which the dummy wafer is placed. A press member(130) gradually attaches a material from a side of the dummy wafer placed on the loading surface. The material to be attached is placed in a position separated from the loading surface by a supporting unit(150). |
申请公布号 |
KR20020078816(A) |
申请公布日期 |
2002.10.19 |
申请号 |
KR20010018968 |
申请日期 |
2001.04.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG, IN SEOK;JI, JUN SU;LEE, HO YEOL;LEE, SANG DO |
分类号 |
H01L21/66;B24B29/02;H01L21/00;H01L51/00;(IPC1-7):H01L21/64 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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