发明名称 APPARATUS FOR ATTACHING SANDPAPER
摘要 PURPOSE: An apparatus for attaching sandpaper is provided to prevent particles from being accumulated on the sandpaper and to prevent air bubbles between the sandpaper and a dummy wafer, by semiautomatically attaching the sandpaper to the dummy wafer. CONSTITUTION: A stage(110) has a loading surface(114) on which the dummy wafer is placed. A press member(130) gradually attaches a material from a side of the dummy wafer placed on the loading surface. The material to be attached is placed in a position separated from the loading surface by a supporting unit(150).
申请公布号 KR20020078816(A) 申请公布日期 2002.10.19
申请号 KR20010018968 申请日期 2001.04.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HWANG, IN SEOK;JI, JUN SU;LEE, HO YEOL;LEE, SANG DO
分类号 H01L21/66;B24B29/02;H01L21/00;H01L51/00;(IPC1-7):H01L21/64 主分类号 H01L21/66
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