发明名称 |
INTEGRATED SILICON CONTACTOR AND APPARATUS AND METHOD FOR FABRICATING THE SAME |
摘要 |
PURPOSE: An integrated silicon contactor and an apparatus and a method for fabricating the same are provided to contact a lead terminal of a semiconductor device with a contact pad of a socket board by forming a conductive silicon portion only on the lead terminal of a semiconductor device and an insulating portion on the remaining region. CONSTITUTION: A conductive silicon portion(12) is contacted with a ball lead(22) of a BGA(Ball Grid Array) semiconductor device(20). An insulating silicon portion(14) is used as an insulating material between the conductive silicon portion(12) and the conductive silicon portion(12). A silicon contactor(10) is mounted on a socket board(24). The conductive silicon portion(12) is contacted with a contact pad(26) of the socket board(24) in order to connect electrically the ball lead(22) of the semiconductor device with the contact pad(26) of the socket board(24). A lower portion(16) of the conductive silicon portion(12) is projected as much as h. The h is about 20 to 50 micro meter.
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申请公布号 |
KR20020079350(A) |
申请公布日期 |
2002.10.19 |
申请号 |
KR20010075606 |
申请日期 |
2001.12.01 |
申请人 |
ISC TECHNOLOGY CO., LTD. |
发明人 |
CHUNG, YOUNG BAE;SHIN, JONG CHEON |
分类号 |
G01R1/067;(IPC1-7):G01R1/067 |
主分类号 |
G01R1/067 |
代理机构 |
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主权项 |
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地址 |
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