发明名称 WAFER HANDLING SYSTEM AND APPARATUS
摘要 An object handling system and apparatus for moving objects through a pressure sensitive system. The present invention can operate in a chamber having a pressurized environment, without adversely influencing or causing pressure changes. The present invention can be used in the transfer chamber of a semiconductor processing system, which has vertically mounted (i.e., vertically integrated) multiple reactors, load locks, and cooling stations, and which requires substantial vertical movement of the handling system. The handling system of the present invention includes a handling mechanism operatively coupled to a robotic device, which is mounted to a driver member. The driver member is movably secured at opposite ends of the chamber in which it operates. The robotic device can translate along the driver member and extend the handling mechanism in the horizontal plane to grab or pick-up an object and move the object to an alternative location.
申请公布号 WO02082507(A1) 申请公布日期 2002.10.17
申请号 WO2002US10731 申请日期 2002.04.04
申请人 WAFERMASTERS, INC. 发明人 YOO, WOO, SIK
分类号 B65G49/07;H01L21/677 主分类号 B65G49/07
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