发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a liquid photosensitive resin composition excellent in developability. SOLUTION: The liquid photosensitive resin composition is obtained by using (F) a surface-treated inorganic pigment as a filler in a photosensitive resin composition comprising (A) an active energy beam curable resin having at least two ethylenically unsaturated bonds in one molecule, (B) at least one selected from dicyandiamide, an organic acid salt of dicyandiamide and its derivative, (C) a photopolymerization initiator, (D) a reactive diluent and (E) a thermosetting epoxy compound.
申请公布号 JP2002296771(A) 申请公布日期 2002.10.09
申请号 JP20010135546 申请日期 2001.03.29
申请人 TAMURA KAKEN CO LTD 发明人 ONO TAKAO;ITO JIN;MASHITA MASUTATSU
分类号 G03F7/004;C08G59/16;C08G59/40;C08K9/02;C08K9/06;C08L63/00;H05K3/00 主分类号 G03F7/004
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