发明名称 Semiconductor device and fabrication method
摘要 A method for forming a semiconductor device that has a fully depleted MOSFET and a partially depleted MOSFET having excellent characteristics on the same substrate without effecting control by means of the impurity concentration of the channel region. A semiconductor device is provided with a fully-depleted SOI MOSFET and a partially-depleted SOI MOSFET on the same SOI substrate through isolation by an element isolation film. The SOI substrate includes a buried oxide film and a SOI layer provided in succession on a silicon substrate.
申请公布号 US6461907(B2) 申请公布日期 2002.10.08
申请号 US20010782056 申请日期 2001.02.14
申请人 NEC CORPORATION 发明人 IMAI KIYOTAKA
分类号 H01L29/786;H01L21/84;H01L27/12;(IPC1-7):H01L21/823;H01L21/00 主分类号 H01L29/786
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