发明名称 INSPECTING METHOD AND EQUIPMENT OF WORK HOLDING BOARD FOR POLISHING, AND POLISHING METHOD OF WORK
摘要 PROBLEM TO BE SOLVED: To provide an inspection method and inspection equipment which estimate easily whether foreign matter or shape failure is present on a holding surface of a holding board, and to provide a method for polishing a work for high planarity. SOLUTION: An inspection plate is vacuum-sucked on the work holding surface of the work holding board for polishing which has a plurality of through holes for holding a work by vacuum suction, and irradiated with arbitrary light. On the basis of information obtained by deformation of the inspection plate which is caused by the foreign matter or the shape failure existing on the work holding surface, the foreign matter or the shape failure existing on the holding surface of the holding board is inspected. A work is held by vacuum suction on the work holding board for polishing from which foreign matter of prescribed size is eliminated, and subjected to polishing.
申请公布号 JP2002289563(A) 申请公布日期 2002.10.04
申请号 JP20010088190 申请日期 2001.03.26
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 TSUCHIYA TOSHIHIRO
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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