发明名称 RESIN CURABLE WITH ACTINIC ENERGY RAY, PHOTOCURABLE/THERMOSETTING RESIN COMPOSITION CONTAINING THE SAME, AND CURED ARTICLE OBTAINED THEREFROM
摘要 A resin curable with actinic energy rays which is obtained by: causing a linear epoxy resin (A') which is a product of the polyaddition reaction of a bifunctional epoxy compound of the hydrogenated bisphenol type (a) with a dicarboxylic acid (b) to add an epihalohydrin (c) at hydroxyl groups of the resin (A') to obtain a polynuclear epoxy resin (A") having epoxy groups at the ends and in side chains; reacting epoxy groups of the polynuclear epoxy resin (A") with an unsaturated monocarboxylic acid (d) to incorporate photopolymerizable unsaturated groups; and further reacting hydroxyl groups of the resin (A') with a polybasic acid anhydride (e) to incorporate carboxyl groups. Mixing this actinic-energy-ray-curable resin with a photopolymerization initiator, a diluent, and a polyfunctional epoxy compound gives a photocurable/thermosetting resin composition developable with aqueous alkali solutions. The photocurable/thermosetting resin composition is useful in applications such as a solder resist for printed wiring boards and an interlayer dielectric for multilayered printed wiring boards.
申请公布号 WO02077058(A1) 申请公布日期 2002.10.03
申请号 WO2002JP02790 申请日期 2002.03.22
申请人 TAIYO INK MANUFACTURING CO., LTD.;MINEGISHI, SHOJI;OGAWA, YUHTA 发明人 MINEGISHI, SHOJI;OGAWA, YUHTA
分类号 C08F283/10;C08G59/14;C08G59/42;C08L15/00;C08L51/08;C08L63/10;C09D5/25;G03F7/038;(IPC1-7):C08G59/14;C08L63/00;C08F299/02;G03F7/027 主分类号 C08F283/10
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