CUTTER GUIDING MEANS IN A SUBSTRATE CUTTING APPARATUS

摘要

A substrate cutting system (10) for performing a cutting operation wherein a substrate portion (12) is cut from a selected substrate (14) comprises a cutter guide (16) and a cutter (18). The cutter (18) and the cutter guide (16) enable the cutting operation to be performed by engaging a substrate engaging surface (20) of the cutter guide (16) with the substrate (14), penetrating the substrate (14) with a blade (38) of the cutter (18), and then moving the cutter (18) with guidable (36) and guiding surfaces (22, 24) of the cutter (18) and cutter guide (16), respectively, engaged with one another such that the surfaces cooperate to guide the cutter (18) so that the cutting edge (68) of the blade (38) cuts the substrate (14) along a cutting path generally similar to the guiding surfaces (22, 24) and provide the substrate portion (12) with a peripheral geometric shape determined by the cutting path.