发明名称 METHOD AND APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNTING SYSTEM, METHOD FOR FORMING DATA ABOUT ELECTRONIC COMPONENT MOUNTING, APPARATUS FOR FORMING MOUNTING DATA AND PROGRAM USED THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting method capable of effectively utilizing an self-alignment effect even when the mounting interval between electronic components is small. SOLUTION: In printing cream solder on a circuit board having lands formed on it and mounting electronic components on it, the position of the printed cream solder is detected on the circuit board to mount the electronic components in reference to the position of the printed cream solder.
申请公布号 JP2002271096(A) 申请公布日期 2002.09.20
申请号 JP20010062227 申请日期 2001.03.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAGAFUKU NOBUYASU;NISHIKAWA NOBORU;KURIBAYASHI TAKESHI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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