| 发明名称 |
Positive photosensitive resin composition |
| 摘要 |
The present invention provides a positive photosensitive resin composition which can form a pattern of high resolution and high residual film ratio and has high sensitivity. That is, the present invention provides a positive photosensitive resin composition comprising 100 parts by weight of a polyamide resin and 1 to 50 parts by weight of a photosensitizer represented by, for example, the following formula (Q-1):
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| 申请公布号 |
US2002119389(A1) |
申请公布日期 |
2002.08.29 |
| 申请号 |
US20020059169 |
申请日期 |
2002.01.31 |
| 申请人 |
MAKABE HIROAKI;BANBA TOSHIO;HIRANO TAKASHI |
发明人 |
MAKABE HIROAKI;BANBA TOSHIO;HIRANO TAKASHI |
| 分类号 |
G03F7/037;C08F299/02;C08G69/26;C08K5/13;C08K5/42;C08L77/00;G03F7/022;G03F7/023;G03F7/075;H01L21/027;(IPC1-7):G03F7/023;G03F7/30 |
主分类号 |
G03F7/037 |
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