| 摘要 |
PROBLEM TO BE SOLVED: To provide a new electroless copper plating method in which formaldehyde is not used, and hydrogen is not generated, and a plating solution composition therefor. SOLUTION: The plating solution composition contains citrate, ethylenediamine, copper sulfate, ferrous sulfate and sodium chloride. The plating solution composition is used at pH 5.5 to 8 and at a temperature of 30 to 70 deg.C, and applies electroless copper plating to the substrate to be plated.
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