| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for reducing the cost and the resources, while even if there are no extra constituent factors and manufacturing a small and thin circuit device, by embedding a conductive path in an insulating resin requiring no usage of a support board. SOLUTION: A conductive foil is pressed with a metallic die having a formation part for a desired conductive path to form a desired conductive path 55A on the conductive foil. A circuit element 55 is mounted. After insulating resin 61 is mounted with the conductive foil as a support board, an joining part of the conductive foil is etched with the insulating resin 61 as the support board which is separated as a conductive path. Without having to adopt the support board, a circuit device having the conductive path 55A and the circuit element 56 supported by the insulating resin 61 is realized.
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