| 摘要 |
PROBLEM TO BE SOLVED: To provide a suspension capable of more effectively radiating heat from an IC chip, and an HGA. SOLUTION: The suspension is provided with a magnetic head slider having at least one thin-film magnetic head, an elastic stainless steel flexure having the magnetic head slider secured thereto, a stainless steel load beam for supporting the flexure and applying a specified load to the magnetic head slider, a base plate secured to the base part of the load beam, an IC chip having a circuit mounted thereon for the thin-film magnetic head element, and a wiring member having the IC chip mounted in the vicinity of the base plate. The base plate is made of a member having thermal conductivity higher than that of stainless steel.
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