发明名称 |
Conductive and resistive materials with electrical stability for use in electronics devices |
摘要 |
<p>An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, optionally either a reactive or a nonreactive diluent, optionally an inert filler, and an oxygen scavenger or corrosion inhibitor or both to provide the electrical stability. Alternatively, the composition may also include a low melting point metal filler component.</p> |
申请公布号 |
EP1231248(A1) |
申请公布日期 |
2002.08.14 |
申请号 |
EP20020002060 |
申请日期 |
2002.02.08 |
申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
CHENG, CHIH-MIN;FREDRICKSON, GERALD;XIAO, YUE;TONG, QUINN K.;LU, DAOQIANG |
分类号 |
C08L101/00;C08K3/00;C08K3/04;C08K3/08;C08K3/22;C08K3/24;C08K3/28;C08K3/34;C08K3/36;C08K5/05;C08K5/06;C08K5/13;C08K5/1515;C08K5/1525;C08K5/17;C08K5/18;C08K5/24;C08K5/25;C08K5/30;C08K5/315;C08K5/32;C08K5/3432;C08K5/3437;C08K5/3445;C08K5/3475;C08K5/357;C08K5/36;C08K5/37;C08K5/375;C08K5/405;C08K5/46;C08K5/47;C08K5/5398;C08K7/06;C08L63/00;C08L101/02;C08L101/06;C09J9/02;C09J11/04;H01B1/12;H01B1/20;H01B1/22;H01B1/24;H01L21/52;H01L23/498;H05K1/09;H05K3/32;(IPC1-7):C09K3/00;H01L23/29 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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