| 摘要 |
PURPOSE:To prevent cracking of a wafer in handling by leaving a part intact about the wafer of a semiconductor device requiring a mesa etching. CONSTITUTION:A mask material for etching is arranged in the surrounding area 27 of a wafer 20 after subjected to a patterning with a photoresist 26 in preparation of a mesa etching to avoid the mesa etching. Otherwise, to avoid the mesa etching in the surrounding area 27, a pattern of a photomask can be made for the patterning of the photoresist 26 or a wax or the like can be applied on the surrounding area. This reduces cracking in the wafer in the handling process following the mesa etching. |
