发明名称 HIGH POLYMER COMPOUND, RESIST MATERIAL AND PATTERN- FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resist material which is sensitive to high energy beams and excellent in the sensitivity, resolution and plasma etching resistance at a wavelength of 200 nm or less, especially 190 nm or less. SOLUTION: The high polymer compound comprises a recurring unit represented by the formula (I) [R1, R2 and R3 are H, F, an alkyl or a fluorinated alkyl; R4 is H or an alkyl; R5 is a single bond or an alkylene; R6 and R7 are H, F or an alkyl and at least one of them contains a fluorine atom; X is -O-or -C(=O)-O-; R8 is an acid labile group; 0<d+e<5, 0<g+h<=5, 0<(a+b)/(a+b+ c)<1, 0<c/(a+b+c)<0.8].
申请公布号 JP2002220416(A) 申请公布日期 2002.08.09
申请号 JP20010346933 申请日期 2001.11.13
申请人 SHIN ETSU CHEM CO LTD;MATSUSHITA ELECTRIC IND CO LTD;CENTRAL GLASS CO LTD 发明人 HATAKEYAMA JUN;HARADA YUJI;WATANABE ATSUSHI;SASAKO MASARU;ENDO MASATAKA;KISHIMURA SHINJI;OTANI MITSUTAKA;MIYAZAWA SATORU;TSUTSUMI KENTARO;MAEDA KAZUHIKO
分类号 G03F7/004;C08F212/04;C08F216/14;C08F220/26;G03F7/039;G03F7/38;H01L21/027 主分类号 G03F7/004
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