| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the work efficiency, pertaining to the method of fixing electronic components. SOLUTION: In this method, a paste-form first conductive adhesive 3 is applied on the first land of a substrate 1, and next the electrode of the first electronic part 2 is bonded onto the first conductive adhesive 3, and then the first conductive adhesive 3 is fused and solidified to fix the electrode of the first electronic component onto the first land, and next the first electronic component 2 is fixed onto the substrate 1 by nonconductive adhesive 5.</p> |
