发明名称 STAGGERED WIRE BONDING METHOD
摘要 PURPOSE: A staggered wire bonding method is provided to be capable of minimize the moving distance of an X-Y table, reducing VLL(Video Lead Locating) time, and improving productivity. CONSTITUTION: After designating a bonding pad(P1) and a lead(L1) as the first points for teaching, the most adjacent bonding pad(P2) and lead(L2) are designated as the next bonding pad and lead for teaching according to a predetermined direction. Then, bonding pads(P3,P4,P5,P6,P7,P8) are sequentially designated as the next pads for teaching corresponding to the leads(L3,L4,L5,L6,L7,L8) without differentiating inner and outer portions of the pad. At this time, the teaching process is completed by a single-revolution process, so that a wire bonding process is simplified.
申请公布号 KR100348828(B1) 申请公布日期 2002.08.01
申请号 KR19950041898 申请日期 1995.11.17
申请人 HYNIX SEMICONDUCTOR INC. 发明人 MUN, YEONG GYU
分类号 H01L21/60 主分类号 H01L21/60
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