| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow temperature adjusting device by which a reflow temperature is adjusted low with reference to a specific electronic component, when different reflow temperatures are set as recommended with reference to respective electronic components in order to reflow soldering with infrared rays, and to provide a reflow soldering method. SOLUTION: In the reflow temperature adjusting device, the reflow temperature is adjusted with reference to specific electronic component in order to reflow soldering with the infrared rays. The adjusting device is formed so as to cover the electronic components by forming a prescribed space between the electronic components mounted on a printed-wiring board. When reflow soldering, the printed-wiring board is installed so as to cover the electronic components whose reflow temperature is adjusted to a low level. |
