发明名称 WAFER BURN-IN SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a relatively inexpensive wafer burn-in system that can be press-contacted evenly with all terminals, even if the number of the terminals with which the system is brought into contact in batch, in a state of a wafer increases. SOLUTION: A contactor 13 is constituted of a flexible circuit bard 15 of polyimide, etc., which is held between supporting rings 14, and has contacting terminals 16 which are provided correspondingly to the electrodes provided in all chip areas of a wafer WF and utilized for burn-in tests on its surface. The contactor 13 is connected to the body 12 of a tester and delivers and received signals to and from the body 12. An air-pressure unit 17, on which the contactor 13 is mounted has a mechanism of giving an air pressure to the rear surface side of the circuit board 15, and all of the contacting terminals 16 are connected in batch to the electrodes (not shown) provided in all chip regions of the wafer FW and utilized for the burn-in tests by means of air pressure.
申请公布号 JP2002208620(A) 申请公布日期 2002.07.26
申请号 JP20010001850 申请日期 2001.01.09
申请人 SEIKO EPSON CORP 发明人 OOTA HIRONORI
分类号 G01R31/26;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01R31/26
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