发明名称 EPILATION PROCESS
摘要 PROBLEM TO BE SOLVED: To provide an epilation process of good epilation performance and yet capable of reducing pain or skin stimulus for persons having much or thick hair growing where it is not wanted. SOLUTION: The process employs an epilation sheet having an epilation layer, which is liquid at the body temperature (36 deg.C) and hardened at temperatures lower than that. Pasting the epilation sheet on a depilating portion and then cooling the same through the sheet hardens the epilation layer to catch unwanted hairs and at the same time also cools the epilation portion of the skin, so that it provides good epilation performance and can reduce pain or skin stimulus.
申请公布号 JP2002204716(A) 申请公布日期 2002.07.23
申请号 JP20010003812 申请日期 2001.01.11
申请人 NITTO DENKO CORP 发明人 TAKAHASHI HISANORI
分类号 A45D26/00;A61K8/00;A61K8/92;A61Q9/04;(IPC1-7):A45D26/00;//A61K7/1 主分类号 A45D26/00
代理机构 代理人
主权项
地址