METHOD AND STRUCTURE FOR CONNECTING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To prevent the occurrence of a solder bridge between adjacent terminals. SOLUTION: The land 13a of a conductor pattern 13 formed on the connection face of a flexible printed wiring board 5 constituted of thermoplastic resin is electrically connected to the land 11a of a conductor pattern 11 formed on the connection face of a rigid printed wiring board 2 through solder 14. Since solder resist 20 terminated in a position where a tip part is inserted into a part of the adhesion face of the printed wiring boards 2 and 5 is formed between the conductor patterns 11 of the rigid printed wiring board 2, the occurrence of the solder bridge can securely be prevented between the adjacent conductor patterns 11 even if the quantity of solder 14 supplied between the lands 11a and 13a is excessive and it sticks out to the surface of the board 2.