SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A substrate for a semiconductor package is provided to improve adhesion of a wire by preventing epoxy from flowing to a wire bond finer unit, and to maintain stable conductivity by preventing leads from being short-circuited by the inflow of the epoxy. CONSTITUTION: The wire bond finer is patterned in thermosetting resin(2) for a substrate. A solder mask is applied to the periphery of the wire bond finger(4a). The epoxy(8) is applied to a portion over the solder mask to attach a semiconductor chip(6). An epoxy intercepting unit is installed in a connection part in which the substrate is electrically connected to a copper pattern so that the epoxy is not introduced.