| 摘要 |
A method of making a semiconductor chip assembly includes the steps of providing a semiconductor chip with contacts and a dielectric substrate wiring layer with terminals, forming a plurality of conductive elastomeric posts such that each post connects one terminal to one contact, and injecting a compliant material between the semiconductor chip and the dielectric substrate wiring layer to form a compliant layer.Another method of making a semiconductor chip assembly includes the steps providing a semiconductor chip with contacts and a dielectric substrate wiring layer with terminals, dispensing a conductive elastomeric material over each of the contacts or over each of the terminals; juxtaposing the chip and the wiring layer such that conductive elastomeric material connects each of the contact to one of the terminals; injecting a compliant material between the chip and the wiring layer and around the conductive elastomeric material to form a compliant layer, and curing the conductive elastomeric material and the compliant material.
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