发明名称 Tamper-responding encapsulated enclosure having flexible protective mesh structure
摘要 A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.
申请公布号 US2002084090(A1) 申请公布日期 2002.07.04
申请号 US20010753932 申请日期 2001.01.03
申请人 FARQUHAR DONALD S.;FEGER CLAUDIUS;MARKOVICH VOYA;PAPATHOMAS KONSTANTINOS I.;POLIKS MARK D.;SHAW JANE M.;SZEPAROWYCZ GEORGE;WEINGART STEVE H. 发明人 FARQUHAR DONALD S.;FEGER CLAUDIUS;MARKOVICH VOYA;PAPATHOMAS KONSTANTINOS I.;POLIKS MARK D.;SHAW JANE M.;SZEPAROWYCZ GEORGE;WEINGART STEVE H.
分类号 G06F12/14;G06F1/00;G06F21/00;G06F21/06;G06F21/22;H01L23/58;H05K1/00;H05K1/02;H05K1/09;H05K1/16;(IPC1-7):H01L23/02 主分类号 G06F12/14
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