SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PURPOSE: To suppress the generation of the package crack of a semiconductor chip on an upper side and the deterioration of the reliability of connection in a semiconductor device for which two semiconductor chips are joined and packaged. CONSTITUTION: In this semiconductor device functioning as a three-dimensional device for which two semiconductor chips are joined, the back surface of the semiconductor chip on the upper side is ground, the entire side face of the semiconductor chip on the upper side is covered with a resin layer, or the center of the semiconductor chip on the upper side is made thicker than a peripheral part. Thus, the generation of the package crack is suppressed and the reliability of the semiconductor device is improved.