发明名称 |
Thermally driven micro-pump buried in a silicon substrate and method for fabricating the same |
摘要 |
The present invention relates to a micro electro mechanical system (MEMS); and, more particularly, to a micro pump used in micro fluid transportation and control and a method for fabricating the same. The micro pump according to the present invention comprises: trenches formed in a silicon substrate in order to form a pumping region including a main pumping region and an auxiliary pumping region; channels formed on both sides of the pumping region; a flow prevention region having backward-flow preventing layers to resist a fluid flow; inlet/outlet regions formed at each of the channels which are disposed on both ends of the pumping region; an outer layer covering the trenches of the silicon substrate and opening portions of the inlet/outlet regions; and a thermal conducting layer formed on the outer layer and over the main pumping region so that a pressure of the fluid in the main pumping region is increased by the thermal conducting layer.
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申请公布号 |
US2002081866(A1) |
申请公布日期 |
2002.06.27 |
申请号 |
US20010834586 |
申请日期 |
2001.04.12 |
申请人 |
CHOI CHANG-AUCK;JANG WON-ICK;JUN CHI-HOON;KIM YUN-TAE |
发明人 |
CHOI CHANG-AUCK;JANG WON-ICK;JUN CHI-HOON;KIM YUN-TAE |
分类号 |
B81C1/00;B81B3/00;F04B19/24;F04B43/04;F04B53/10;(IPC1-7):C23F1/00;H01L21/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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