发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING IT |
摘要 |
PURPOSE: To enable to efficiently discharge the moisture from a semiconductor device to the outside at the time of reflow when the semiconductor device is mounted on another implemented board. CONSTITUTION: A semiconductor chip 1 is mounted on a circuit board 2 through an adhesive resin layer 3, and moisture discharging openings 7 are formed in the circuit board 2. Depressions 8 having a width of opening larger than the diameter of opening of the moisture discharging openings 7 are formed in parts of the adhesion resin layer 3 exposed in the moisture discharging openings 7 on the adhesive resin layer 3. |
申请公布号 |
KR20020047019(A) |
申请公布日期 |
2002.06.21 |
申请号 |
KR20010079578 |
申请日期 |
2001.12.14 |
申请人 |
SHARP CORPORATION |
发明人 |
DOTTA YOSHIHISA;SAZA YASUYUKI;TAMAKI KAZUO |
分类号 |
H01L23/12;H01L23/00;H01L23/16;H01L23/28;H01L23/31;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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