发明名称 Enhanced mounting pads for printed circuit boards
摘要 There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.
申请公布号 US6405920(B1) 申请公布日期 2002.06.18
申请号 US20000614830 申请日期 2000.07.12
申请人 VISTEON GLOBAL TECHNOLOGIES, INC. 发明人 BRUNNER BJOERN ERIK;JAIRAZBHOY VIVEK AMIR;MCMILLAN RICHARD KEITH
分类号 H05K1/11;H05K3/34;(IPC1-7):B23K31/02 主分类号 H05K1/11
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