发明名称 |
SPINDLE ASSEMBLY FOR FORCE CONTROLLED POLISHING |
摘要 |
<p>A spindle assembly for force controlled operation in applications such as the chemical mechanical planarization of semiconductor wafers includes an axially and rotatably movable spindle driven by a force producing device. The force producing device is controlled by a position feedback loop in a first mode of operation and a spindle force control feedback loop in a second mode of operation so that the same force producing device controls spindle movement in the first mode of operation and maintains a constant pressure on a workpiece based on the detected applied pressure in the second mode of operation.</p> |
申请公布号 |
EP1207981(A1) |
申请公布日期 |
2002.05.29 |
申请号 |
EP20000955424 |
申请日期 |
2000.08.11 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
SALDANA, MIGUEL, A. |
分类号 |
B24B41/047;B24B37/005;B24B41/04;B24B49/10;B24B49/16;G05B19/39;(IPC1-7):B24B37/04 |
主分类号 |
B24B41/047 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|