发明名称 SURFACE ACOUSTIC WAVE ELEMENT AMD ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a surface acoustic wave element that has an electric connection pad whose mechanical strength is enhanced. SOLUTION: The surface acoustic wave element 10 is provided with a substrate 11 for propagating a surface acoustic wave, an electrode 12 that is used to make energy conversion between an electric signal and the surface acoustic wave, a protection film 13 that covers the electrode and the substrate and is provided with an aperture 14 to partially expose the electrode, and the pad 15 that is electrically connected to the electrode via the aperture. The electrode is placed to cover the substrate over the opening area by the aperture and the pad is coupled with the electrode and the edge of the aperture of the protection film under its lower side.
申请公布号 JP2002152002(A) 申请公布日期 2002.05.24
申请号 JP20000342927 申请日期 2000.11.10
申请人 OKI ELECTRIC IND CO LTD 发明人 HAKAMATA SHINICHI;WATANABE YUKIO
分类号 H01L21/302;H01L21/3065;H03H3/08;H03H9/145;(IPC1-7):H03H9/145;H01L21/306 主分类号 H01L21/302
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