| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a flip-chip mounting method using a thermosetting non- conductive adhesive on a printed circuit board with good reliability. SOLUTION: A flip-chip 2 has an Au bump 21. The printed circuit board 1 has an outermost layer 12 formed of a resin having a higher transition temperature than a glass transition temperature of the adhesive, and a conductor pad 121 of Au-plating on a surface of the outermost layer. The method for mounting the flip-chip comprises the steps of previously coating the adhesive 3 on the board 1, aligning the bump 21 with the pad 121, and then heating the board 1 and the adhesive 3 in a temperature range higher than the glass transition temperature of the layer 12 while pressing the flip-chip 2 without losing a restoring force. In this case, the flip-chip 2 is depressed and cooled until the electrode surface of the flip-chip is contacted with the surface of the outermost layer in the layer 12 softened by heating. Thus, bubbles contained in the adhesive 3 are exhausted, a recoiling force of the depressed pad 121 becomes a contact pressure of the bump 21 with the pad 121 to improve reliability of the connection.</p> |
