发明名称 SUBSTRATE HOLDER AND THIN FILM FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To realize stable substrate holding and easy release of the substrate after transfer of a thin film. SOLUTION: Related to a thin film forming device, a wafer 1 facing downward is held with a substrate holder 102b. A sheet film 2 on which a thin film is formed is placed on a transfer plate with the surface on which the thin film is formed facing upward. The substrate holder 102b approaches the transfer plate and the thin film is transferred onto the wafer 1. The substrate holder 102b comprises a plurality of substrate holding mechanisms which comprises a movable support 202 which contacts the transfer plate at transferring and rises, and a holding claw 201 which holds the wafer 1 with the substrate mount surface of the holder and, when the movable support 202 rises during holding, releases the wafer by rotating.
申请公布号 JP2002134594(A) 申请公布日期 2002.05.10
申请号 JP20000324365 申请日期 2000.10.24
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 MACHIDA KATSUYUKI;SATO NORIO;KURAKI OKU
分类号 C23C14/50;C23C16/458;H01L21/203;H01L21/205;H01L21/31;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 C23C14/50
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