| 摘要 |
PURPOSE: To provide a resin for reliably bonding a semiconductor chip. CONSTITUTION: An adhesive 12 contains a polymerizable main resin component, a main curing agent for causing self polymerizing reaction of the main resin component, and a subcuring agent for causing additional polymerizing reaction of the main resin component. When the adhesive 12 is coated on a substrate 13 to bond a semiconductor chip 11 thereto and then heated, the subcuring agent is additionally polymerized to the backbone of a three-dimensional net structure formed by the self polymerizing reaction of the main resin component. A first temperature, at which the additional polymerized part is changed to a rubber-like structure, is lower than a second temperature at which the backbone is changed to a rubber-like structure. As a result, a decrease rate in the elasticity modulus at the first temperature become abruptly large, thus lightening a stress between the chip 11 and substrate 13. |
