| 发明名称 |
Semiconductor module |
| 摘要 |
The present invention is to provide a semiconductor module, which can effectively dissipate heat generated by the semiconductor components disposed on the circuit board, with a simple structure to manufacture inexpensively.
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| 申请公布号 |
US6381137(B1) |
申请公布日期 |
2002.04.30 |
| 申请号 |
US20000620720 |
申请日期 |
2000.07.20 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KATO NOBUHIRO;NAKAJIMA TAKAO;KUSUI MASAAKI |
| 分类号 |
H01L23/36;H01L23/367;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/36 |
| 代理机构 |
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