| 摘要 |
<p>A method of producing surface acoustic wave devices comprising the steps of forming a first film on a piezoelectric board, forming a second film on the first film, forming a resist pattern of predetermined shape on the second film, isotropically or anisotropically etching the second and first films with the resist pattern used as a mask, isotropically etching the first film alone into an undercut form, removing the resist patter, forming an electrode material layer on the entire surface, and lifting off the electrode material layer present on the second film by etching the second film for removal, thereby forming electrodes.</p> |
