发明名称 Semiconductor laser module and method for assembling the same
摘要 One viewpoint of the invention intends to improve the working efficiency of fabricating a semiconductor laser module. For example, each of conductive connectors is fixed to both ends of insulation coated conductors to form conductors equipped with the conductive connectors. Pins of an inner module (case) are inserted and fixed to the conductive connectors on one end side of the insulation coated conductors. Pins of a package are inserted and fixed to the conductive connectors on the other end side. A semiconductor laser device housed inside the inner module can be conducted and connected to outside the package through the pins, the insulation coated conductors and the pins. Simple work only to insert and fix the pins to the conductive connectors can conduct and connect the pins to the pins and the working efficiency of fabricating the semiconductor laser module can be enhanced.
申请公布号 US2002044578(A1) 申请公布日期 2002.04.18
申请号 US20010820935 申请日期 2001.03.30
申请人 THE FURUKAWA ELECTRIC CO., LTD. 发明人 IIZUKA SHINICHIRO;KIMURA TOSHIO
分类号 H01R4/70;H01R4/04;H01R4/18;H01R9/11;H01R11/28;H01S5/022;H01S5/042;(IPC1-7):H01S3/04;H01S5/00 主分类号 H01R4/70
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