发明名称 Method of fabricating compound semiconductor device
摘要 Disclosed is a method of fabricating a compound semiconductor device, which has an Al-based compound semiconductor layer and is suitable for producing, for example, a semiconductor laser device with a buried structure. The method comprises a first step of sequentially performing vapor growth of a plurality of compound semiconductor layers including an Al-based compound semiconductor layer formed on a semiconductor substrate by using a metalorganic chemical vapor deposition (MOCVD), thereby forming a semiconductor multilayer (epitaxial layer) having, for example, a double heterostructure; a second step of selectively etching a specific compound semiconductor layer in the semiconductor multilayer other than the Al-based compound semiconductor layer in the MOCVD using a bromine-based gas, thereby forming a mesa; and a third step of regrowing a predetermined compound semiconductor layer on the semiconductor multilayer in the MOCVD following the etching step.
申请公布号 US2002043209(A1) 申请公布日期 2002.04.18
申请号 US20010938640 申请日期 2001.08.27
申请人 THE FURUKAWA ELECTRIC CO., LTD. 发明人 ARAKAWA SATOSHI;KASUKAWA AKIHIKO
分类号 H01L21/302;B82Y10/00;B82Y20/00;B82Y40/00;H01L21/20;H01L21/205;H01L21/3065;H01S5/20;H01S5/223;H01S5/227;(IPC1-7):C30B28/12;C30B23/00;C30B28/14;C30B25/00 主分类号 H01L21/302
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