| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device structure and an electronic device, which contribute to reduction of the thickness, size and weight or the like in terms of the structure of a semiconductor device, can be embodied using a general device in the aspect of manufacturing and can be manufactured on full mass production basis with respect to cost. SOLUTION: In the semiconductor device having a structure, in which a plurality of wafer units (10, 20 and 30) are laminated, the first wafer unit 10 is used as a wafer base, the other units (20, 30 and the like) are bonded in series from the first unit 10 via bumps (21, 31 and 32) formed on the surface (20A, 20B, 30A and 30B) of the units, thereby forming a wafer unit laminated 3D structure on the semiconductor substrate. |
