发明名称 HEAT-CONDUCTIVE POLYMER COMPOSITION AND HEAT-CONDUCTIVE MOLDING
摘要 <p>PROBLEM TO BE SOLVED: To obtain both a heat-conductive polymer composition and a heat- conductive molding having high thermal conductivity capable of effectively radiating an intense heat generated from electric parts, electronic parts, etc. SOLUTION: This heat-conductive polymer composition comprises a polymer material and a graphitized carbon fiber as a heat-conductive filler, the graphitized carbon fiber contains boron and interplanar spacing (d002) between graphite layers exhibiting a degree of graphitization by an X-ray diffraction method of a graphitized carbon fiber is <0.3360 nm. The content of boron is preferably 0.1-10 wt.% based on the graphitized carbon fiber. The peak intensity ratio of (P101/P100) of (101) diffraction peak to (100) diffraction peak is preferably >=1.70. The graphitized carbon fiber is obtained by using a mesophase pitch as a raw material, spinning, infusibilizing, carbonizing, grinding and graphitizing in the presence of a boron-containing graphitization catalyst. This heat-conductive molding is obtained by molding and processing the heat- conductive polymer composition into a fixed shape.</p>
申请公布号 JP2002097371(A) 申请公布日期 2002.04.02
申请号 JP20000285601 申请日期 2000.09.20
申请人 POLYMATECH CO LTD 发明人 HIDA MASAYUKI
分类号 C08J5/00;C08K7/06;C08L101/00;H01L23/373;(IPC1-7):C08L101/00 主分类号 C08J5/00
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