| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame in which the pretreatment process of a lead frame blank is improved, and to provide a plating method for the lead frame. SOLUTION: The manufacturing method for the lead frame contains an electrolytic degreasing step, in which the surface of a thin plate blank is electrolytically degrease in advance, an electrolytic polishing step in which the degreased blank is electrolytically polished, an inclusion removal step in which an inclusion appearing on the surface of the electrolytically polished blank is removed, a cleaning step in which the blank having completed the removal step of the inclusion is cleaned by an acid solution, and a plated-layer formation step in which a multilayer plated layer is formed on the cleaned blank. In the lead frame which is manufactured by the manufacturing method, since as the insulation which obstructs a wire-bonding characteristic and a solder wetting characteristic and which has a diameter of at least about 1μm, 5 or fewer pieces per surface area of 1,600μm2 are contained. |
