| 摘要 |
A method of aligning microstructures using guides, which enables an align bonding technique, which is a technique in the Micro Electro Mechanical System (MEMS) field, with a cheap microscope of low power. In a system including upper and lower structures having different patterns, array guides combined to four sides of the upper structure, and align guides positioned at four sides of the lower structure to form walls, which are regularly spaced apart, the method is to align the upper and lower structures with lowering the array guide into an align portion formed between the array guide and the align guide. Though a 3D (3-dimensional) pattern such as a membrane structure or a trench structure made by a minute surface micro machining is formed at the structure, this method facilitates alignment without damage of the 3D pattern and without an expensive align device.
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