摘要 |
PROBLEM TO BE SOLVED: To provide film formation treating equipment which can make effective ozone having oxidation effect come into contact effectively with a film formation region of a substrate, and realize miniaturization and cost reduction of equipment. SOLUTION: This film formation treating equipment is provided with a gas supplying means 1 for supplying material gas for film formation containing at least ozone, a heating means 2, a mounting base 3 for mounting and heating a substrate W, and one or more nozzles 4 for jetting the material gas G for film formation against the substrate W mounted on the base 3. The material gas G jetted from the nozzles 4 comes into contact with the whole part of a region Wa of the substrate W which part is necessary for film formation, before a prescribed time passes from the jetting time of gas.
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