| 摘要 |
PROBLEM TO BE SOLVED: To detect with a high accuracy and in a short time the amount of displacement of the fixed point of a part to be bonded by a bonding device using a lens of high power even if the fixed point is beyond the image range of the camera. SOLUTION: Multiple images in the proximity of the fixed point to be detected of the part to be bonded are stored as map image information and the position of the part to be bonded is detected by using the map image information. The fixed point of the part to be bonded is detected by moving an image pickup means according to the detected position, and position detection can be performed at a high speed even if the fixed point of the IC chip 6 and the like is placed beyond the range of imaging of the camera. Also, the amount of displacement of the fixed point of the part to be bonded from the reference point is stored in sequence, the average of the amount of displacement is calculated, the position is found by subtracting the calculated average of the amount of displacement from the reference point, the camera is moved to the found position, and the amount of displacement of the fixed point of the part to be bonded is detected. |
