Method of fabricating a field emission device on the sidewalls of holes formed in an insulator layer

摘要

A method of fabricating a field emission device is disclosed. A conductive layer is etched back by means of a reactive ion etching (RIE) process to form a chimney-shaped structure of diode-type or triode-type to serve as a field emitter. The field emission device of the present invention can be manufactured at a temperature of below 400° C., without complicated techniques or equipment, and is suitable for application in flat panel displays having large area.