Carrier substrate for producing semiconductor device

摘要

In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate 12 which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess 16 formed at a position of the metal substrate 12 corresponding to the resin protuberance and having a rugged bottom surface 16a and/or a rugged side surface, and a plated film 14 formed on the inner surface of the recess 16.