发明名称 IMAGE PICKUP DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an image pickup device, with which focusing can be easily attained into no control by decreasing the number of components and reducing errors in production. SOLUTION: In the image pickup device provided with an image pickup element 1 for converting a formed optical image to an electric signal, a substrate 3A where the image pickup element 1 is flip chip mounted onto the lower surface and an optical image pickup system 2 for forming the optical image on the image pickup element 1, the optical image pickup system 2 is provided by integrally molding a lens 2a formed from a transparent member and a supporting means 2b formed from a member, which holds the lens 2, not to transmit light. In this case, integral molding is based on insert molding. Thus, the number of components can be decreased. Further, an error to affect the focusing performance of the image pickup device can be reduced by integral molding. Besides, by applying an adhesive agent 4 around the bonding part of the optical image pickup system 2 and the substrate 3A, the optical image pickup system 2 can be adhered to the substrate 3A while eliminating the thickness error of the adhesive agent 4.
申请公布号 JP2002051268(A) 申请公布日期 2002.02.15
申请号 JP20000232729 申请日期 2000.08.01
申请人 MITSUBISHI ELECTRIC CORP;ECHO:KK 发明人 KUNO TETSUYA;SUGIURA HIROAKI;YAMAZAKI TAKAYUKI
分类号 G02B7/02;H01L27/14;H04N5/225;H04N5/335;H04N5/372;H04N5/374;(IPC1-7):H04N5/335 主分类号 G02B7/02
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