发明名称 |
Substrate holding apparatus and substrate polishing apparatus |
摘要 |
<p>A substrate holding apparatus (1) comprises a substrate holder body (2) having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring (3) fixedly secured to the substrate holder body (2). The retainer ring (3) is arranged to surround an outer periphery of the substrate (W) held by the substrate holder body (2) so that the retainer ring (3) engages with the polishing surface radially outside the substrate (W) as the polishing of the substrate (W) is effected. The substrate holder body (2) is provided with a membrane (4) having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body (2) to define a fluid pressure chamber (8) to which a fluid pressure is applied. The outer surface engages with the substrate (W) held by the substrate holder body (2). <IMAGE></p> |
申请公布号 |
EP1177859(A2) |
申请公布日期 |
2002.02.06 |
申请号 |
EP20010117745 |
申请日期 |
2001.07.30 |
申请人 |
EBARA CORPORATION |
发明人 |
GUNJI, YOSHIHIRO;YASUDA, HOZUMI;NAMIKI, KEISUKE;YOSHIDA, HIROSHI |
分类号 |
H01L21/304;B24B37/30;B24B37/32;(IPC1-7):B24B37/04;B24B41/06 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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